Suspended superconducting qubits

ABSTRACT

A qubit system includes a substrate layer, a qubit circuit suspended above the substrate layer and fine structure disposed between the qubit circuit and the substrate layer.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.13/834,291, filed Mar. 15, 2013, the disclosure of which is incorporatedby reference herein in its entirety.

BACKGROUND

The present invention relates to quantum computing, and morespecifically, to suspended superconducting qubits and methods ofmanufacturing the same.

Superconducting quantum circuits containing Josephson junctions arecurrently being pursued as the information-storing building blocks(i.e., quantum bits, or qubits) of a quantum computer. A basic challengetowards this goal is developing devices whose quantum coherence lastslong enough to enable control and measurement with error rates below thebounds requisite for quantum error correction. Lossy materials withinthe mode volume of superconducting resonant structures impose a limit onhow long such systems can store energy. Reducing the participation ratioof energy-storing non-vacuum materials (inclusive of surfaces,interfaces, thin films, and bulk matter) within the mode volumeincreases this limit. In particular, two-level systems present atsurfaces and interfaces of superconducting qubits are believed to be asignificant source of decoherence. The substrate-to-metal interface andsubstrate-to-air interface are believed to be a source of loss. Typicalsuperconducting qubits are manufactured with aluminum thin filmsdeposited on an insulating substrate of silicon or sapphire.

SUMMARY

Exemplary embodiments include a qubit system, including a substratelayer, a qubit circuit suspended above the substrate layer and finestructure disposed between the qubit circuit and the substrate layer.

Additional exemplary embodiments include a method of fabricating a qubitsystem, the method including forming a qubit circuit on a substrate andundercutting the substrate such that a fine structure remains suspendingthe qubit circuit above remaining substrate.

Further exemplary embodiments include a method of fabricating a qubitsystem, the method including forming a plurality of metallic anchorswithin a substrate, forming a qubit circuit on the substrate andremoving a portion of the substrate.

Additional features and advantages are realized through the techniquesof the present invention. Other embodiments and aspects of the inventionare described in detail herein and are considered a part of the claimedinvention. For a better understanding of the invention with theadvantages and the features, refer to the description and to thedrawings.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

The subject matter which is regarded as the invention is particularlypointed out and distinctly claimed in the claims at the conclusion ofthe specification. The forgoing and other features, and advantages ofthe invention are apparent from the following detailed description takenin conjunction with the accompanying drawings in which:

FIG. 1A illustrates a perspective view of an exemplary suspended qubitcircuit device;

FIG. 1B illustrates a cross sectional view of the exemplary suspendedqubit circuit device of FIG. 1A, taken along the line A;

FIG. 1C illustrates a cross sectional view of the exemplary suspendedqubit circuit device of FIG. 1A, taken along the line B;

FIG. 1D illustrates a cross sectional view of the exemplary suspendedqubit circuit device of FIG. 1A, taken along the line C;

FIG. 2 illustrates a flow chart of a method of fabricating a suspendedqubit circuit device in accordance with exemplary embodiments;

FIG. 3A illustrates a perspective view of an intermediate structure ofexemplary suspended qubit circuit device;

FIG. 3B illustrates a perspective view of an intermediate structure ofexemplary suspended qubit circuit device;

FIG. 3C illustrates a cross sectional view of an exemplary suspendedqubit circuit device, taken along the line A′;

FIG. 3D illustrates a cross sectional view of an exemplary suspendedqubit circuit device, taken along the line B; and

FIG. 4 illustrates a flow chart of a method of fabricating a suspendedqubit circuit device in accordance with exemplary embodiments.

DETAILED DESCRIPTION

In exemplary embodiments, the systems and methods described hereininclude superconducting quantum circuits for quantum informationprocessing in which circuit components (linear and non-linear) areformed by a thin-film superconductor suspended above the surface of asubstrate. This orientation removes the substrate-to-metal interface andmoves the substrate-to-air interface further away from the electricfields of the resonant modes of the quantum circuit. Several methods ofmaking the exemplary suspended qubits are now described herein. Inexemplary embodiments, the qubit circuit is suspended above and coupledto the substrate. As further described herein, the fine structure can beremaining substrate material after undercut processing is implemented.The fine structure can also be anchors fabricated between the qubitcircuit and the substrate.

FIG. 1A illustrates an exemplary suspended qubit circuit device 100.FIGS. 1B-1D illustrate cross sectional views of the exemplary suspendedqubit circuit device 100 of FIG. 1A. FIG. 2 illustrates a flow chart ofa method 200 of fabricating a suspended qubit circuit device inaccordance with exemplary embodiments. At block 210, a qubit circuit 110is fabricated on a substrate 120.

Fabrication of the qubit circuit may proceed by any of a number ofprocesses that are well-known in the art. Two examples are (1)subtractive patterning of a trilayer(superconductor(s)-insulator-superconductor(s)) material stack or (2)the Dolan bridge process. Although several other qubit fabricationprocedures are contemplated, the Dolan Bridge technique is describedherein as an illustrative example. The main fabrication technique is nowdescribed, using a Josephson junction (asuperconductor-insulator-superconductor sandwich) as an example. Inexemplary embodiments, the substrate 120 can be low resistivity (Borondoped) two-inch silicon wafers. A bilayer of resist is spun on thewafers, which consists of a copolymer methyl methacrylate (MMA) layerand a subsequent thinner layer of polymethyl methacrylate (PMMA). Usingelectron-beam lithography, a pattern for the qubit circuit 110 iswritten into the resist. This step is followed by development in anMIBK:IPA (Methyl Isobutyl Ketone (MIBK) Isopropyl alcohol (IPA)) (1:3)solution for about one minute, which eats away all the areas exposed tothe electron beam. The MMA layer is more sensitive to the electron beam,which creates areas of undercut PMMA. As such, a suspended bridge out ofthe PMMA can be made with no MMA beneath. The sample is placed in ane-beam evaporator where Al is evaporated at two angles with oxidation(in an Ar/O₂ atmosphere) between Al evaporations. The junction is formedin the overlap area. The remaining resist and unwanted metal is removedby placing the sample in acetone. Using this lift-off technique,junction areas can be made ranging from 20 mm² to 50 nm². This basicfabrication process can be used with other extra fabrication steps suchas PECVD, optical lithography, and RIE to make more complicated devices.Finally, the wafer is diced into small (˜1×1 cm²) chips. In exemplaryembodiments, as part of the qubit circuit 110, a Josephson BifurcationAmplifier (JBA) can be fabricated. A JBA is a current amplifier based onthe non-linear inductance of the Josephson junction. It was designed asa sensitive readout device for a qubit in the qubit circuit 110. Acapacitor is fabricated in parallel with the junction to form anon-linear LC oscillator with two stable oscillating states. Thecapacitor is formed by depositing a copper ground plane followed by asilicon nitride insulating layer (in PECVD). Resist is then spun overthe chip. The junction with top capacitor electrodes is subsequentlydeposited using the procedure described above. Chromium (Cr) layerssandwiching a copper (Cu) layer are used to protect the Cu duringsilicon nitride deposition while a titanium (Ti) layer is utilized topromote adhesion of a silicon nitride layer. FIG. 1A illustrates thequbit circuit 110 formed on the substrate 120.

In exemplary embodiments, the qubit circuit 110 (which will be anexemplary suspended qubit) is fabricated on a silicon (Si) substrateusing materials that are stable in xenon difluoride (XeF₂) etchingprocedures, including aluminum (Al), aluminum oxide (Al_(x)O_(y)), andtitanium nitride (TiN). In exemplary embodiments, the substrate 120 isselected to reduce dielectric loss tangent at low temperatures. Thesubstrate 120 is also selected to be a material which can be etchedselectively to the superconducting and dielectric material to be usedfor the qubit circuit 110. For example, high resistivity Si wafers maybe implemented.

Referring still to FIG. 2, at block 220, the substrate 120 is undercutbeneath the qubit circuit 110. As described herein, undercut ofsubstrate 120 can be implemented using substrate etching selective toqubit materials (e.g., deposited using Dolan bridge process). Forexample, for an Al/Al₂O₃/Alqubit on the Si substrate, a XeF₂ etch may beused.

In exemplary embodiments, the substrate 120 is undercut only along theperimeter of the qubit features as illustrated in FIG. 1 B. In otherexemplary embodiments, the Si substrate 120 is completely undercut frombeneath finer features as shown in FIG. 1C, using a timed XeF₂ etch, andthe qubit circuit 110 is anchored by larger features which are notcompletely undercut as shown in FIG. 1D. In other exemplary embodiments,the qubit circuit 110 is fabricated on a Si-on-sapphire (SOS) substrateand the Si portion of the substrate 120 is removed using a timed etch.

In other exemplary embodiments, holes are patterned in the Si portion ofthe SOS substrate, and anchors are formed in these holes which supportthe suspended structures when the Si is completely removed, as nowdescribed.

FIG. 3A illustrates an intermediate structure 301 of exemplary suspendedqubit circuit device showing anchors 305 disposed in a sacrificialsubstrate layer 315, which is disposed atop a substrate 320. FIG. 3Billustrates an intermediate structure 302 of the exemplary suspendedqubit circuit device with a qubit circuit 310. FIGS. 3C-3D illustratecross sectional views of the exemplary suspended qubit circuit device303.

FIG. 4 illustrates a flow chart of a method 400 of fabricating asuspended qubit circuit device in accordance with exemplary embodiments.At block 405, anchors 305 (e.g., a metallic conductive material) areformed in the sacrificial substrate layer 315. In exemplary embodiments,holes in which the anchors 305 are disposed can be patterned with anysuitable photolithography techniques, and the anchors deposited with anysuitable metallic deposition techniques. As described here, the wholesubstrate layer (i.e., the substrate 320 and sacrificial substrate layer315) may be chosen with at least two materials. The bulk material (e.g.,the substrate 320) remains after the processing is finished, and thesacrificial material (e.g., the sacrificial substrate layer 315) ispartially or fully removed during processing. The bulk material isselected to reduce dielectric loss tangent at low power.

The sacrificial material is selected to be etched selectively to thebulk substrate as well as the superconducting and dielectric material tobe used for the qubit. If sacrificial material is not completelyremoved, then it should be chosen to reduce dielectric loss tangent atlow temperatures. An example of a suitable substrate would beSilicon-on-sapphire (SOS), where the Si is the sacrificial material andthe sapphire is the bulk material. As described herein, the anchor holesmay be patterned using photolithography and etched into the sacrificiallayer of the substrate. For a SOS substrate, examples of suitable etchmethods include chlorine (Cl) or fluorine (F)-based RIE, XeF₂ vaporetch, or ammonia or potassium hydroxide (KOH) based chemical wet etch.After Si etch, the resist mask may be removed using any suitabletechnique.

Referring still to FIG. 4, at block 410, the qubit circuit is formed. Asdescribed herein, qubit fabrication may proceed by any of a number ofprocesses that are well-known in the art. Two examples are (1)subtractive patterning of a trilayer(superconductor(s)-insulator-superconductor(s)) material stack or (2)the Dolan bridge process. Although several other qubit fabricationprocedures are contemplated, the Dolan Bridge technique is describedherein as an illustrative example. The main fabrication technique is nowdescribed, using a Josephson junction (asuperconductor-insulator-superconductor sandwich) as an example. Inexemplary embodiments, the substrate 320 can be low resistivity (Borondoped) two-inch silicon wafers. It is appreciated that the qubit isformed atop the sacrificial substrate layer 315 and the anchors 305. Abilayer of resist is spun on the wafers, which consists of a copolymerMMA layer and a subsequent thinner layer of PMMA. Using ebeamlithography, a pattern for the qubit circuit 310 is written into theresist. This step is followed by development in an MIBK:IPA (1:3)solution for about one minute, which eats away all the areas exposed tothe electron beam. The MMA layer is more sensitive to the electron beam,which creates areas of undercut PMMA. As such, a suspended bridge out ofthe PMMA can be made with no MMA beneath. The sample is placed in ane-beam evaporator where Al is evaporated at two angles with oxidation(in an Ar/O₂ atmosphere) between Al evaporations. The junction is formedin the overlap area. The remaining resist and unwanted metal is removedby placing the sample in acetone. Using this lift-off technique,junction areas can be made ranging from 20 mm² to 50 nm². This basicfabrication process can be used with other extra fabrication steps suchas PECVD, optical lithography, and RIE to make more complicated devices.Finally, the wafer is diced into small (˜1×1 cm²) chips. In exemplaryembodiments, as part of the qubit circuit 310, a IBA can be fabricated.Resist is then spun over the chip. The junction with top capacitorelectrodes is subsequently deposited using the procedure describedabove. Cr layers sandwiching a Cu layer are used to protect the Cuduring silicon nitride deposition while a Ti layer is utilized topromote adhesion of a silicon nitride layer. FIG. 3 b illustrates thequbit circuit 310 formed on the sacrificial substrate layer 315, and theanchors 305.

At block 420, the sacrificial substrate layer 315 is removed with anysuitable etching technique. As described herein, the sacrificialsubstrate layer 315 is selected to be etched by techniques that do notetch the substrate 320, the anchors 305 and the qubit circuit 310. FIGS.3C and 3D illustrate the qubit circuit 310 suspended above the substrate320, and supported by the anchors 305.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of onemore other features, integers, steps, operations, element components,and/or groups thereof.

The corresponding structures, materials, acts, and equivalents of allmeans or step plus function elements in the claims below are intended toinclude any structure, material, or act for performing the function incombination with other claimed elements as specifically claimed. Thedescription of the present invention has been presented for purposes ofillustration and description, but is not intended to be exhaustive orlimited to the invention in the form disclosed. Many modifications andvariations will be apparent to those of ordinary skill in the artwithout departing from the scope and spirit of the invention. Theembodiment was chosen and described in order to best explain theprinciples of the invention and the practical application, and to enableothers of ordinary skill in the art to understand the invention forvarious embodiments with various modifications as are suited to theparticular use contemplated

The flow diagrams depicted herein are just one example. There may bemany variations to this diagram or the steps (or operations) describedtherein without departing from the spirit of the invention. Forinstance, the steps may be performed in a differing order or steps maybe added, deleted or modified. All of these variations are considered apart of the claimed invention.

While the preferred embodiment to the invention had been described, itwill be understood that those skilled in the art, both now and in thefuture, may make various improvements and enhancements which fall withinthe scope of the claims which follow. These claims should be construedto maintain the proper protection for the invention first described.

What is claimed is:
 1. A method of fabricating a qubit system, the method comprising: forming a qubit circuit on a substrate; and undercutting the substrate such that a fine structure remains suspending the qubit circuit above remaining substrate.
 2. The method as claimed in claim 1 wherein the fine structure couples the qubit circuit to the substrate layer.
 3. The method as claimed in claim 1 wherein a substrate-to-air interface is removed from electric fields of the resonant modes of the quantum circuit.
 4. The method as claimed in claim 1 wherein the fine structure is a portion of the substrate that has been undercut to form an undercut structure.
 5. The method as claimed in claim 4 wherein the undercut structure is formed by undercutting along the perimeter of features of the qubit circuit.
 6. The method as claimed in claim 4 wherein the undercut structure is formed by completely undercutting the qubit circuit.
 7. The method as claimed in claim 4 wherein the substrate is a on a Si-on-sapphire (SOS) substrate.
 8. The method as claimed in claim 7 wherein a silicon (Si) portion of the SOS substrate is removed to form the fine structure.
 9. A method of fabricating a qubit system, the method comprising: forming a plurality of metallic anchors within a substrate; forming a qubit circuit on the substrate; and removing a portion of the substrate.
 10. The method as claimed in claim 9 wherein the substrate comprises: a bulk material layer; and a sacrificial material layer, wherein the metallic anchors are disposed in the sacrificial layer and couple the bulk material layer to the qubit circuit.
 11. The method as claimed in claim 10 wherein the portion of the substrate that is removed is the sacrificial material layer. 